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South
Bay Circuits
Registered
to ISO 9001:2000
Certificate
# A3951
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RVC
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| Integrated Technology Capabilities |
Assembly
- Surface Mount and Plated Through Hole
assembly
- Backpanel Press-Fit Assembly
- Card Cage and Enclosure Assembly
- Cable and Harness Assembly
- Mechanical Assembly
- Full Turnkey Production Assemblies
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Components
- BGA / Micro-BGA to .5mm pitch
- Fine pitch SMT devices to .3mm pitch
- 0201's
- Fine pitch PTH components to 1mm
- Custom Components
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Processes
- IPC Certified Hand Soldering
- Water Soluble Fluxes with 100% DI Water,
closed loop cleaning.
- Convection Re-Flow Soldering
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Quality Control
- Full Vision Printing with 2D Paste
Inspection
- Level II / Level III / ICT / Functional
Testing
- Ionic Contamination Testing
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© 2002 South Bay
Circuits, Incorporated. All Rights Reserved. |
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