Assembly

Integrated Technology Capabilities Click Photo to Enlarge
 Assembly
  • Surface Mount and Plated Through Hole assembly
  • Backpanel Press-Fit Assembly
  • Card Cage and Enclosure Assembly
  • Cable and Harness Assembly
  • Mechanical Assembly
  • Full Turnkey Production Assemblies
Pick and Place
 Components
  • BGA / Micro-BGA to .5mm pitch
  • Fine pitch SMT devices to .3mm pitch
  • 0201's
  • Fine pitch PTH components to 1mm
  • Custom Components
Assembly
 Processes
  • IPC Certified Hand Soldering
  • Water Soluble Fluxes with 100% DI Water, closed loop cleaning.
  • Convection Re-Flow Soldering
Card Cage
 Quality Control
  • Full Vision Printing with 2D Paste Inspection
  • Level II / Level III / ICT / Functional Testing
  • Ionic Contamination Testing
 Sales & Technical Support
  • Design Assistance, DFM and PCB Layout
  • Quick Turn Assemblies Within 5 Days
  • Concurrent Engineering (Shorten Time To Market Through Early Involvement)
Integrated Technologies

Equipment list

SBC Capability Matrix