South Bay Circuits

Registered to ISO 9001:2000

Certificate # A3951

RVC

Material

• High Temperature FR4 > 170 Tg

• Getek / Nelco-13 / Polyimide

• Rogers 3000 & 4000 Series

• Copper Foil - HTE 1/8 oz. - 4oz.

• Thin Core Material Down to .0025 mils

• Multilayer Down to 0.015 thick

• 0.230 Thick PCB's

• Prototype Line Capability - Internal (0.003") - External (0.004")
• 0.010 mil pitch SMT, BGA, uBGA
• AOI Inspection

• Blind / Buried Vias
• Micro Vias - Laser Ablated / C02
• Controlled Depth Drilling & Routing
• Aspect Ratio 10:1
• 0.010" Thru Hole Drill / 0.008" Blind Via Drill
• Thru Holes with Pads 0.008" over drill

• Electroless Nickel Immersion Gold
• Silver Immersion
• White Tin Immersion  (Omikron)
• Hard Gold
• Soft Bondable Gold
• Entek 106A
• Hot Air Solder Leveling (SMOBC)
• Solder Reflow
• Edge Plating
• Resistive Inks (1 - 30ohms)

• Soldermask Registration to 0.002"
• Soldermask Dams between SMT features with 0.007" space
• Soldermask Colors - Green, Blue, Red, Black, and Clear
• Legend / Silkscreen - Single or Double Side Color: White

• 100% Netlist Testing
• TDR Testing / Impedance
• IPC-356 Netlist Compare
• Test Fixtures Assembled On Site

• SBC offers microvias for prototype needs.
• Densities down to 4 mil diameter with 10 mil capture pads.
• Today we only offer (1 + 1) BUM designs
• Although we have successfully created microvias utilizing reactive ion etching, we have found laser technologies to be a more consistent and efficient approach.
• Ensuring the plating integrity of these blind microvias require the aspect ratio to be no greater than 1:1.

© 2002 South Bay Circuits, Incorporated.  All Right Reserved.