• High Temperature FR4 > 170 Tg
• Getek / Nelco-13 / Polyimide
• Rogers 3000 & 4000 Series
• Copper Foil - HTE1/2 oz. - 4oz.
• Thin Core Material Down to .0025 mils
• Multilayer Down to 0.015 thick
• 0.230 Thick PCB's max

• Prototype Line Capability - Internal (0.004") - External (0.004")
• 0.010 mil pitch SMT, BGA, uBGA
• AOI Inspection

• Blind / Buried Vias
• Controlled Depth Drilling & Routing
• Aspect Ratio 10:1
• 0.010" Thru Hole Drill / 0.008" Blind Via Drill
• Thru Holes with Pads 0.008" over drill

• Electroless Nickel Immersion Gold
• Silver Immersion
• Hard Gold
• Soft Bondable Gold
• Hot Air Solder Leveling (SMOBC)
• Solder Reflow
• Edge Plating
• Resistive Inks (1 - 30ohms)

• Soldermask Registration to 0.002"
• Soldermask Dams between SMT features with 0.007" space
• Soldermask Colors - Green, Blue, Red, Black, and Clear
• Legend / Silkscreen - Single or Double Side

• 100% Netlist Testing
• TDR Testing / Impedance
• IPC-356 Netlist Compare
• Test Fixtures Assembled On Site

Equipment List