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South
Bay Circuits
Registered
to ISO 9001:2000
Certificate
# A3951
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RVC
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Materials
- High Temperature FR4
- Low Dk FR4
- Polyimide
- Rogers
- Hybrid Multilayers
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Computer Aided
Manufacturing
- Valor / Genesis
- Gerber netlist extraction
- Netlist download for AOI
- DFM reviews
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Surface Finishes
- HASL
- Entek Cu 106
- White Tin
(Omikron)
- Electroless Nickel / Immersion Gold
- Gold Body (Electrolytic)
- Wire Bondable Soft Gold
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Testing
- Test area 15.5 x 19.2
- CAD netlist comparison
- TDR single-ended impedance
- TDR differential impedance
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Density
- 3 mil lines with 4 mil spaces
- 10 mil drill in 18 mil pads
- 4 mil laser via with 10 mil capture pad
- .8mm pitch BGA's
- Blind and Buried vias, including
sequentially laminated blind vias.
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Soldermask
- LPI (liquid photo-image able)
- Via plugging
- Dams for .4 mm pitch devices
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Registration
- Custom artwork scaling
- Post-etch registration tooling
- X-ray machine for measuring innerlayer
dimensional changes
- Virgin drill tooling holes
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© 2002 South Bay
Circuits, Incorporated. All Rights Reserved. |
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