Computer Aided Manufacturing
- Valor / Genesis
- Gerber netlist extraction
- Netlist download for AOI
- DFM reviews
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Density
- 4 mil lines with 4 mil spaces
- 10 mil drill in 18 mil pads
- .8mm pitch BGA's
- Blind and Buried vias, including sequentially
laminated blind vias.
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Materials
- High Temperature FR4
- Low Dk FR4
- Polyimide
- Rogers
Hybrid Multilayers |
Registration
- Custom artwork scaling
- Post-etch registration tooling
- X-ray machine for measuring innerlayer
dimensional changes.
- Virgin drill tooling holes
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Soldermask
- LPI (liquid photo-image able)
- Via plugging
- Dams for .4 mm pitch devices
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Surface Finishes
- Electroless Nickel / Immersion Gold
- Gold Body (Electrolytic)
- HASL
- Silver Immersion
- Wire Bondable Soft Gold
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Testing
- Test area 15.5 x 19.2
- CAD netlist comparison
- TDR single-ended impedance
- TDR differential impedance
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VIA Fill
- Conductive Epoxy VIA Fill
- Non Conductive Epoxy VIA Fill
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Registered to
ISO 9001:2008 |
Certificate
# 10000903 QM08
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