PCB Assembly Capabilities

Backpanel PCBA

Mixed Technologies Assembly Placement - SMT and Through-Hole for Printed Circuit Boards and Circuit Card Assemblies

Surface Mount Technology (SMT) / Surface Mount Devices (SMDs) Single or Double Sided – Down to 0201 Packages – Fine Pitch down to .3mm and smaller with engineering review.

BGAs (Ball Grid Arrays) Micro-BGA – High Density Interconnections (HDI)

Automated mounting of SMD components

RoHS and/or Lead Finishes (Lead and Lead-Free Soldering)

Conformal Coating & Potting

Backplane - Backpanel Specialist

Through-Hole devices (PTH) wave or hand soldering

SMT reflow and/or wave soldering

Quad-Flat Pack IC, Leadless Chip Carriers/CSP, and Custom Components

Automatic Optical Inspection (AOI)

Automated Solder Paste Application

Complete Electronic or Mechanical Assembly & Box Builds

 

X-Ray MachineTest Solutions include:

Automated Optical Inspection (AOI)

In-Circuit Test

  • Reliability test (Hi-pot, vibration, burn in, high and low temperature test)
  • Firmware programming
  • Analogue & digital functional test
  • Design For Test (DFT) Processes
  • BGA X-Ray Evaluation
  • Functional Testing
  • Framescan

Component and Process Traceability

Workmanship to IPC-A-610

SBC Guidelines for PCB Assembly Manufacturability (PDF)

Certified ISO9001
ISO 9001:2008

SBC is an ISO 9001:2008 certified company through UL-DQS. South Bay Circuits utilizes ISO 9001:2008 eight fundamental quality management principles to help improve our PC Board Fab, PC Assembly, and Box Build performance. Certificate #: 10000903 QM08
 

ITAR Registration
ITAR registered printed circuit board fabrication

ITAR Registered! We are a manufacturer that builds defense articles with related technical data that can be defined on the United States Munitions List (Part 121 of the ITAR), where we are registered.

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