High Density Interconnect (HDI) PCB’s

Paul Zebb - Tuesday, August 01, 2017

High Density Interconnect (HDI) PCB’s

HDI technology is rapidly expanding in the PCB world. This technology allows significantly denser and smaller board construction and packaging allowing for substantially more components per square inch. Basically, it’s more technology-functionality in less space. HDI has proven invaluable and critical in the production of electronic equipment with smaller and tighter space. Cell phones, laptops, and high speed performance and computing would not be possible without HDI as we know it today

Examples of HDI technology include fine lines and spaces, sequential lamination, back-drilling, non-conductive and conductive via fill, blind vias, buried vias, and microvias. These are specifically PCB technologies that are allowing tight and miniaturized packaging. They also allow higher levels of performance like controlled impedance and satellite technologies.Designing and

manufacturing HDI PCB’s come with an increased cost, but one that must be embraced and mastered to meet the ever demanding requirements of the Electronic Industry.

South Bay Circuits is here to meet your HDI PCB needs.


History of the PCB

Paul Zebb - Wednesday, July 26, 2017

History of the PCB

 

South Bay Circuits, Inc. is a leader in PCB and PCBA design, layout, fabrication, testing and assembly. So where did it all begin?

Development of the methods used in modern printed circuit boards started early in the 20th century. In 1903, a German inventor, Albert Hanson, described flat foil conductors laminated to an insulating board, in multiple layers. Thomas Edison experimented with chemical methods of plating conductors onto linen paper in 1904. Arthur Berry in 1913 patented a print-and-etch method in the UK, and in the United States Max Schoop obtained a patent to flame-spray metal onto a board through a patterned mask. Charles Ducas in 1927 patented a method of electroplating circuit patterns.

Development of the methods used in modern printed circuit boards started early in the 20th century. In 1903, a German inventor, Albert Hanson, described flat foil conductors laminated to an insulating board, in multiple layers. Thomas Edison experimented with chemical methods of plating conductors onto linen paper in 1904. Arthur Berry in 1913 patented a print-and-etch method in the UK, and in the United States Max Schoop obtained a patent to flame-spray metal onto a board through a patterned mask. Charles Ducas in 1927 patented a method of electroplating circuit patterns.

The Austrian engineer Paul Eisler invented the printed circuit as part of a radio set while working in the UK around 1936. In 1941 a multi-layer printed circuit was used in German magnetic influence naval mines. Around 1943 the USA began to use the technology on a large scale to make proximity fuses for use in World War II. After the war, in 1948, the USA released the invention for commercial use. Printed circuits did not become commonplace in consumer electronics until the mid-1950s, after the Auto-Sembly process was developed by the United States Army. At around the same time in the UK work along similar lines was carried out by Geoffrey Dummer, then at the RRDE.

Before printed circuits (and for a while after their invention), point-to-point construction was used. For prototypes, or small production runs, wire wrap or turret board can be more efficient. Predating the printed circuit invention, and similar in spirit, was John Sargrove's 1936–1947 Electronic Circuit Making Equipment (ECME) which sprayed metal onto a Bakelite plastic board. The ECME could produce three radio boards per minute.

Source: Wikipedia

 


Drastically Reduce New Product Integration (NPI) Time: Step 5 of 5

Paul Zebb - Tuesday, July 11, 2017

 

Drastically Reduce New Product Integration (NPI) Time: Step 5 of 5

 

Processing/manufacturing in-parallel rather than in-series.

 

Specifically: Orders for components and materials should be placed by your supplier prior or at the time pc bare board manufacturing starts. This will help insure components and materials are ready for assembly when the pc bare boards are completed. Additionally utilizing a company that controls the entire process: layout through assembly will provide the added benefit of single source accountability, improved delivery, and performance.

Summary: Following the 5 Key Steps to Slashing NPI time saves both time and money. It creates the option to get deliveries in historic timeframes at reduced costs or more importantly significantly faster for the same cost.

 

To view the complete 5 steps, click here.

 

 

What is a PCB

Paul Zebb - Wednesday, July 05, 2017

What is a PCB

Have you ever opened up your computer or phone? The PCB or printed circuit board is the flat, typically green, piece that holds all the chips and/or electrical components. Below the green solder mask/overlay, are wires/traces on the board. They connect the components, creating circuits.

A PCB that has yet to have any electrical components soldered onto it, is called a “bare board”, or more properly, a “printed circuit board”. There are however copper traces called "wiring" that have been created by printing, plating, and etching processes.

To produce a PCB you need to take the functional diagram or schematic and transform it into a piece of artwork that makes a pattern for components, holes, and circuits/wires. The PCB designer is the engineer who creates the schematic. It is similar to the plates used in printing, although technically quite different.

PCB’s range in size, and are used in a multitude of products way too extensive to list, but here are a few: cell phones, autos, computers, TV’s, flash drives, thermostats, vehicles, weapons, and video game consoles. If it’s electronic, a PCB is probably the board holding the brains behind it.

Drastically Reduce New Product Integration (NPI) Time: Step 2 & 3 of 5

Paul Zebb - Tuesday, June 13, 2017

 

Drastically Reduce New Product Integration (NPI) Time: Step 2 & 3 of 5

The PCB/PCBA timeframe of new product integration can be significantly reduced by following 5 logistical steps.

Step 2 & 3: Removing Lag Time for the Quoting and PO processes.  

These 2 steps can be completed in parallel with the design/layout phase to greatly reduce or eliminate delays.

  • Quoting
  • Purchase Orders

The process of design/layout, quoting, issuing of PO’s and mfg. of PCB’s and PCBA’s are typically done in a sequential manner. Simply changing the timing of attaining quotes and PO’s as a parallel process can “completely” remove this delay.In many cases this time takes as long as mfg. itself.

Bare boards and assembly quotes and PO’s can be completed and issued during the Layout process. Worst case adjustments can be made when the final version files are created.

 

Next in the series,
Step 4: Preventing Mfg. Delays – Information Control.

 

WORLD’S QUICKEST – PCB LAYOUT TO LOADED ASSEMBLY

Paul Zebb - Monday, June 05, 2017

WORLD’SQUICKEST – PCB LAYOUT TO LOADED ASSEMBLY

South Bay Circuits, Inc. provides the World’s Quickest – PCB Layout to Loaded Assembly. If getting your design manufactured and to the marketplace first is critical to your success SBC is your best solution. No one beats our New Product Introduction (NPI) and New Product Development (NPD) capabilities. SBC supports any or all of your PCB layout, bare board fabrication, and/or assembly needs.

WE DELIVER IN HOURS AND DAYS WHAT OUR COMPETITORS DELIVER IN DAYS AND WEEKS

What We Do

  • Quick-Turn Prototypes
  • PCB Designs
  • PCB Layout Services
  • PCB Board Fabrication
  • PCB Assembly - Circuit Card Assembly
  • Backplane Assembly
  • PCB Testing and Final Assembly
  • Fully Integrated Electronic Box Builds – Turnkey
  • Domestic Production and Offshore Volume Production

With SBC's diverse capabilities and flexibility to service, we take great pride in being able to meet the demands of all or any portions of your requirements, whether it be for PCB Design\Layout, PCB Board Manufacturing, PCB Assembly, or Electronic Box Build. From Prototyping to Production; we are here to make you a success.

GET A QUOTE FOR YOUR PROJECT TODAY

Drastically Reduce New Product Introduction (NPI) Time: Step 1 of 5

Paul Zebb - Friday, May 19, 2017

Drastically Reduce New Product Introduction (NPI) Time: Step 1 of 5

The PCBA phase of new product introduction can be significantly reduced by following 5 logistic steps.

Step 1: Organize the process & develop a materials list:

This step has a dual approach in the design phase.

  • Determine critical components
  • Create a process checklist

First, gather a list of your critical/specialty components and determine their availability. You could use a web service like https://www.eciaauthorized.com/en for example. Knowing when materials will be available provides a clear timeline for product introduction.

Second, create a footprint of the process. Map out each phase of the project from design to mfg. This will flag issues early and provide the opportunity to address and resolve in a timely manner.

Get your suppliers engaged up front, particularly if unique and/or undefined aspects to your design exist. A lower cost, higher quality product will be your reward. Saving time and money should not be an option.

 

Next in the series,
Step 2 & 3: Removing lag time for quotes & PO’s.

 


Certified ISO9001
ISO 9001:2008

SBC is an ISO 9001:2015 certified company through UL-DQS. South Bay Circuits utilizes ISO 9001:2015 eight fundamental quality management principles to help improve our PC Board Fab, PC Assembly, and Box Build performance. Certificate #: 10000903 QM15
 

ITAR Registration
ITAR registered printed circuit board fabrication

ITAR Registered! We are a manufacturer that builds defense articles with related technical data that can be defined on the United States Munitions List (Part 121 of the ITAR), where we are registered.

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