PC Board Assembly Testing
SBC has an extensive array of testing equipment and systems. These include Automatic Optical Inspection (AOI), X-Ray Examination (BGA’s), Functional Testing, & In-Circuit Testing (ICT). Each of these test methods serves different functions.
AOI testing provides a scan of components for proper placement. X-Ray Examination insures that BGA’s are installed and soldered correctly and will detect any shorts or poor solder joints. Functional Testing provides a partial or 100% test of the finished product. Typically these functional testers are provided by our Customers or designed and manufactured by us with their cooperation. ICT is an electrical probe test on populated PCB’s, checking for shorts, opens, resistance, capacitance, and other basic parameters to demonstrate correct assembly.
Design Assistance, Design for Manufacturability, and PC Board Layout
SBC works closely with our Customers in the early stages of design through volume production. Through this entire process evaluations are done on manufacturability, reliably, and cost reduction. By being involved in the entire process from start to product release and beyond the optimal conditions and specifications are created to produce the best possible design.