PCB Technologies & Processes
SBC works closely with Customers from design stages through production release and beyond to insure the highest level of quality and reliability at the lowest cost. Extensive experience in the PCB industry and our uniquely flexible approach allows us to produce a wide variety of technologies to meet customer requirements. Our goal and focus is to insure our Customer’s success.
Fine Line Trace & Space Densities
SBC’s typical design builds encompass .004” lines and spaces as well as engineering reviewed designs produced down to .003”/.003”. Although fine line technology is readily available using lines and spaces at .005” or greater whenever possible may help avoid additional manufacturing costs. Download SBC Guidelines for PC Board Manufacturability (PDF)
We work closely with our Customers early in design stages recommending effective stack-ups that insure functionality and cost effectiveness. SBC handles all varieties of Controlled Impedance requirements including: Embedded Micro strip, Offset Stripline, Edge coupled coated micro strip, Edge coupled offset Stripline in both single-ended and differential configurations. Also produced are Coated Coplanar Strips and Coplanar Waveguide.
Liquid Photoimageable (LPI) Solder Mask
SBC offers LPI solder mask in multiple colors (green is the industry standard and best cost option) including: Green, Red, Clear, Black, and Blue. Tight tolerances can be held to accommodate high density Surface Mount Devices (SMD) including registration within .002” and LPI dams between SMT pads with spacing down to .007”.
Backplanes - Backpanels
SBC has been a specialist in the manufacture of Backplanes since the 1980's, perfecting the unique techniques and methods needed to meet tight tolerances and specifications required for this product. No one in the industry surpasses our experience in this area, both in bare boards and assembly.
Blind and Buried Vias
SBC produces high density PCB that require the use of Blind and Buried Vias. This option, although more costly than standard PC Board technology, provides the ability to substantially increase densities to meet ever tightening designs and miniaturization requirements.
Solder Mask Via Plugging
SBC can produce boards adding an additional solder mask operation that specifically plugs vias to assist in vacuum draw-down during In-Circuit-Test (ICT). Only one side of a via can be plugged, as plugging both sides allows solution entrapment causing out-gassing during the assembly soldering process.
When vias are in tight conjunction to each other or other exposed metal, simply covering vias with solder mask helps prevent shorting at assembly.
Dry Film Solder Mask – Via Cap Only
This process is another alternative, as above “Solder Mask Via Plugging”; with the only difference being Dry Film rather than wet applied solder mask is used. Either process will typically do the job, with Dry Film being the more expensive alternative.
Via Hole Filling (non-conductive)
Yet another technology to assist in designing and manufacturing high density boards is to fill vias so that the drill via hole can be placed at the location of the Surface Mount Technology pad, filled, and then plated over, saving the space of having the via fan-out from the pad. Again a process with additional cost but one that may be an effective way of solving high density design issues.